First Place

Category 1: TEM

Peter Ercius

FEI(Tecnai)-Duffield

Three dimensional reconstruction of four Ta liners filled with Cu to make 90nm wide wires in nano-sized electrical devices. The structures were reconstructed from 73 STEM projections at 2° tilt increments from -73° to 71° by electron tomography. Typical (S)TEM projections do not show the roughness of the Cu/Ta interface.

Applied and Engineering Physics
Advisor David Muller