Garlock GEM-T Jet mill | ||
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Location: Bard Hall B47 |
Philip Carubia | |
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Jet mill Training required to use this instrument: |
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Pulverization takes place in the central chamber of the jet mill as the process material is driven at near sonic velocity around the perimeter of the toroidal chamber by multiple jets of air. No grinding media is involved. Size reduction is the result of the high-velocity collisions between particles of the process material itself. The interior of the chamber is designed to allow recirculation of over-sized particles, enhancing the incidence and the effect of these collisions. As particles are reduced in size and progressively lose mass, they naturally migrate toward the central discharge port. | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Electronic & Magnetic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- X-ray Photoelectron Spectroscopy
- EELS Microscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- Surface Analysis and Characterization
- X-ray photoelectron spectroscopy
- Asylum-MFP3D-Bio-AFM-SPM
- Veeco Dimension 3100 Ambient AFM STM
- JEOL JSPM 4500 UHV STM
- Nanonics Multiview 1000 or 2000 Near-field Scanning Optical Microscopy (NSOM)
- Renishaw InVia Confocal Raman microscope
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- Waters MALDI Micro MX (MALDI-TOF)
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Dynamic Testing
- Hardness Testing
- Micro Mechanical testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Wet chemical
- Heat Treating
- Shaping/Pressing
- Molding
- Cold pressing
- Glove Boxes
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Abrasive Saws
- Diamond Saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Machining
- Wire Pulling
- Welding/ Brazing/ Bonding
- Spot welding
- Wire Bonding
- Test Equipment Lending Library
- General Test and Measurement Equipment
- Leak detectors
- Portable Vacuum and Pump Systems
- Optical Pyrometers
- Balances
- Rough Pumps
- Poster Help and Printing
Search Equipment
Other Facilities
Facilities Contact

Jurriaan Gerretsen
- Director of Shared Facilities
- t. 607.279.6955



