Olympus BH-2 with darkfield | ||
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Bard SB58 |
John Hunt | |
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Light microscope |
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Darkfield light microscopy highlights subtle surface features by only allowing illumination from low angles to reach the specimen. There is an alternative bright fluorescence attachment for this microscope also. Our digital camera can be used to record images. | ||
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50x to 400x magnification is available. Primarily designed for reflected light. | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- CNS Electronics Measurements
- Chemistry NMR Spectroscopy
- Surface Analysis and Characterization
- X-ray Photoelectron Spectroscopy
- Scanning Probe Microscopy
- Near field Scanning Optical Microscopy
- Confocal Raman Microscopy
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- MALDI-TOF Mass Spectrometry
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Particle Size Analysis
- Static Testing
- Dynamic Testing
- Hardness Testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Heat Treating
- Air Furnaces
- Controlled Atmosphere Furnaces
- High Vacuum Furnaces
- Vacuum Ovens
- ThermoElectron Twin Screw Extruder
- Shaping/Pressing
- Extruding
- Molding
- Hot pressing
- Cold pressing
- Glove Boxes
- Spray Drying
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Slurry cutting
- Spark cutting
- Abrasive saws
- Diamond saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Plasma Cleaning
- Ultrasonic Cleaning
- Abrasive Cleaning
- Machining
- Mills
- Lathes
- Drill Presses
- Band Saws
- Spark Cutters
- Surface Grinders
- Wire Pulling
- Welding/ brazing/ bonding
- Spot welding
- Inert Gas welding
- Vaccum Brazing
- Soldering
- Wire Bonding
- General Test and Measurement Equipment
- Leak detectors
- Portable Helium
- Optical Pyrometers
- Balances
- Leak detectors
- Computing and Printing
Search Equipment
Other Facilities
Facilities Contact
Jurriaan Gerretsen
- Director of Shared Experimental Facilities
- t. 607.255.4274
