X-ray photoelectron spectroscopy XPS | ||
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Clark Hall D20 |
Jonathan Shu | |
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XPS |
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UHV system for X-ray photoelectron spectroscopy (XPS), also known as electron spectroscopy for chemical analysis (ESCA). Quantitative elemental analysis as well as chemical bonding information are possible on a variety of samples. Ion sputtering for depth profiling; in-situ sample tilting.
Remote access is available for real-time observation and control of the instrument.
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Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- CNS Electronics Measurements
- Chemistry NMR Spectroscopy
- Surface Analysis and Characterization
- X-ray Photoelectron Spectroscopy
- Scanning Probe Microscopy
- Near field Scanning Optical Microscopy
- Confocal Raman Microscopy
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- MALDI-TOF Mass Spectrometry
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Particle Size Analysis
- Static Testing
- Dynamic Testing
- Hardness Testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Heat Treating
- Air Furnaces
- Controlled Atmosphere Furnaces
- High Vacuum Furnaces
- Vacuum Ovens
- ThermoElectron Twin Screw Extruder
- Shaping/Pressing
- Extruding
- Molding
- Hot pressing
- Cold pressing
- Glove Boxes
- Spray Drying
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Slurry cutting
- Spark cutting
- Abrasive saws
- Diamond saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Plasma Cleaning
- Ultrasonic Cleaning
- Abrasive Cleaning
- Machining
- Mills
- Lathes
- Drill Presses
- Band Saws
- Spark Cutters
- Surface Grinders
- Wire Pulling
- Welding/ brazing/ bonding
- Spot welding
- Inert Gas welding
- Vaccum Brazing
- Soldering
- Wire Bonding
- General Test and Measurement Equipment
- Leak detectors
- Portable Helium
- Optical Pyrometers
- Balances
- Leak detectors
- Computing and Printing
Search Equipment
Other Facilities
Facilities Contact
Jurriaan Gerretsen
- Director of Shared Experimental Facilities
- t. 607.255.4274
