TA Instruments Q500 Thermogravimetric Analyzer (TGA) | ||
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Location: 165 S. T. Olin Chemistry Laboratory |
Anthony Condo | |
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TGA Training required to use this instrument: |
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Detects weight loss as a function of temperature change for a variety of materials, including homopolymers, copolymers, low molecular weight compounds, and mixtures of these, and measures their thermal stability and heat resistance. Determines the moisture content of polymers and related materials and the amount of volatiles in elastomer systems. Routine analyses between ambient and 550°C with capability to perform studies up to 1000°C. Equipped with a 16-chamber auto-sampling platform. | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Electronic & Magnetic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- X-ray Photoelectron Spectroscopy
- EELS Microscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- Surface Analysis and Characterization
- X-ray photoelectron spectroscopy
- Asylum-MFP3D-Bio-AFM-SPM
- Veeco Dimension 3100 Ambient AFM STM
- JEOL JSPM 4500 UHV STM
- Nanonics Multiview 1000 or 2000 Near-field Scanning Optical Microscopy (NSOM)
- Renishaw InVia Confocal Raman microscope
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- Waters MALDI Micro MX (MALDI-TOF)
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Dynamic Testing
- Hardness Testing
- Micro Mechanical testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Wet chemical
- Heat Treating
- Shaping/Pressing
- Molding
- Cold pressing
- Glove Boxes
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Abrasive Saws
- Diamond Saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Machining
- Wire Pulling
- Welding/ Brazing/ Bonding
- Spot welding
- Wire Bonding
- Test Equipment Lending Library
- General Test and Measurement Equipment
- Leak detectors
- Portable Vacuum and Pump Systems
- Optical Pyrometers
- Balances
- Rough Pumps
- Poster Help and Printing
Search Equipment
Other Facilities
Facilities Contact
Jurriaan Gerretsen
- Director of Shared Facilities
- t. 607.279.6955
