TA Instruments Q500 Thermogravimetric Analyzer (TGA) | ||
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165 S. T. Olin Chemistry Laboratory |
Anthony Condo | |
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TGA |
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Detects weight loss as a function of temperature change for a variety of materials, including homopolymers, copolymers, low molecular weight compounds, and mixtures of these, and measures their thermal stability and heat resistance. Determines the moisture content of polymers and related materials and the amount of volatiles in elastomer systems. Routine analyses between ambient and 550°C with capability to perform studies up to 1000°C. Equipped with a 16-chamber auto-sampling platform. | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- CNS Electronics Measurements
- Chemistry NMR Spectroscopy
- Surface Analysis and Characterization
- X-ray Photoelectron Spectroscopy
- Scanning Probe Microscopy
- Near field Scanning Optical Microscopy
- Confocal Raman Microscopy
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- MALDI-TOF Mass Spectrometry
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Particle Size Analysis
- Static Testing
- Dynamic Testing
- Hardness Testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Heat Treating
- Air Furnaces
- Controlled Atmosphere Furnaces
- High Vacuum Furnaces
- Vacuum Ovens
- ThermoElectron Twin Screw Extruder
- Shaping/Pressing
- Extruding
- Molding
- Hot pressing
- Cold pressing
- Glove Boxes
- Spray Drying
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Slurry cutting
- Spark cutting
- Abrasive saws
- Diamond saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Plasma Cleaning
- Ultrasonic Cleaning
- Abrasive Cleaning
- Machining
- Mills
- Lathes
- Drill Presses
- Band Saws
- Spark Cutters
- Surface Grinders
- Wire Pulling
- Welding/ brazing/ bonding
- Spot welding
- Inert Gas welding
- Vaccum Brazing
- Soldering
- Wire Bonding
- General Test and Measurement Equipment
- Leak detectors
- Portable Helium
- Optical Pyrometers
- Balances
- Leak detectors
- Computing and Printing
Search Equipment
Other Facilities
Facilities Contact
Jurriaan Gerretsen
- Director of Shared Experimental Facilities
- t. 607.255.4274
