Multiwire Back-Reflection Laue Detector | ||
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Location: 1102 Snee Hall |
Maura Weathers | |
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Laue Training required to use this instrument: |
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The Laue instrument is used to orient single crystals, from 1 mm to 1 m in diameter. It is also used to determine whether or not samples are single crystals. The orientation of a crystal surface relative to a primary crystallographic direction can be determined to within 0.2 degrees. The heart of the MWL110 system is a multiwire proportional chamber with a 30 cm x 30 cm active area. The detector is equipped with a selection of four interchangeable collimators (0.5, 1.0, 2.0, and 3.0 mm), a fail-safe x-ray shutter, and a gas delivery system. | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Electronic & Magnetic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- X-ray Photoelectron Spectroscopy
- EELS Microscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- Surface Analysis and Characterization
- X-ray photoelectron spectroscopy
- Asylum-MFP3D-Bio-AFM-SPM
- Veeco Dimension 3100 Ambient AFM STM
- JEOL JSPM 4500 UHV STM
- Nanonics Multiview 1000 or 2000 Near-field Scanning Optical Microscopy (NSOM)
- Renishaw InVia Confocal Raman microscope
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- Waters MALDI Micro MX (MALDI-TOF)
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Dynamic Testing
- Hardness Testing
- Micro Mechanical testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Wet chemical
- Heat Treating
- Shaping/Pressing
- Molding
- Cold pressing
- Glove Boxes
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Abrasive Saws
- Diamond Saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Machining
- Wire Pulling
- Welding/ Brazing/ Bonding
- Spot welding
- Wire Bonding
- Test Equipment Lending Library
- General Test and Measurement Equipment
- Leak detectors
- Portable Vacuum and Pump Systems
- Optical Pyrometers
- Balances
- Rough Pumps
- Poster Help and Printing
Search Equipment
Other Facilities
Facilities Contact
Jurriaan Gerretsen
- Director of Shared Facilities
- t. 607.279.6955
