Micro Hardness Tester | ||
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Location: Bard hall B56 |
Philip Carubia | |
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Training required to use this instrument: |
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Indentation measuring modes include Vickers, Knoop and Brinell. Ideal for testing on a wide range of materials, including plating. Rigid construction minimizes compliance errors and an internal memory retains 999 tests. A highly stable load mechanism ensures accurate positioning and high repeatability. Once the load is selected automatic testing begins, including loading, holding and releasing, or highly magnified measurements. Upon completion the turret revolves automatically; switching position from the indenter to an optical microscope. Repositioning accuracy is <0.5 micron. The standard incorporated microscope includes X100 and X400 total magnifications. Loads range from 9 to 20000 millinewtons. | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Electronic & Magnetic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- X-ray Photoelectron Spectroscopy
- EELS Microscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- Surface Analysis and Characterization
- X-ray photoelectron spectroscopy
- Asylum-MFP3D-Bio-AFM-SPM
- Veeco Dimension 3100 Ambient AFM STM
- JEOL JSPM 4500 UHV STM
- Nanonics Multiview 1000 or 2000 Near-field Scanning Optical Microscopy (NSOM)
- Renishaw InVia Confocal Raman microscope
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- Waters MALDI Micro MX (MALDI-TOF)
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Dynamic Testing
- Hardness Testing
- Micro Mechanical testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Wet chemical
- Heat Treating
- Shaping/Pressing
- Molding
- Cold pressing
- Glove Boxes
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Abrasive Saws
- Diamond Saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Machining
- Wire Pulling
- Welding/ Brazing/ Bonding
- Spot welding
- Wire Bonding
- Test Equipment Lending Library
- General Test and Measurement Equipment
- Leak detectors
- Portable Vacuum and Pump Systems
- Optical Pyrometers
- Balances
- Rough Pumps
- Poster Help and Printing
Search Equipment
Other Facilities
Facilities Contact

Jurriaan Gerretsen
- Director of Shared Facilities
- t. 607.279.6955



