Micro Hardness Tester | ||
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Kimball Hall 310 |
John Sinnott | |
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operates on the following principle: an indenter tip with a known geometry is driven into the sample by applying an increasing load to some preset value. The load is then gradually decreased until relaxation of the sample has occurred. The load and displacement are recorded continuously throughout this process to produce a load-displacement curve from which the micro-mechanical properties such as hardness, Young's modulus, stress-strain studies, time dependant creep measurement, fracture toughness, and plastic and elastic energy of the sample can be calculated. The MHT covers a wide load range from 10 mN to 30 N. This load range will permit measurements of coatings down to 1 or 2 microns without the being influenced by the substrate material. Standard micro-hardness tests such as fracture toughness can now be made in a dynamic mode since the depth curve for some materials will show the initiation of cracking in the material | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- CNS Electronics Measurements
- Chemistry NMR Spectroscopy
- Surface Analysis and Characterization
- X-ray Photoelectron Spectroscopy
- Scanning Probe Microscopy
- Near field Scanning Optical Microscopy
- Confocal Raman Microscopy
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- MALDI-TOF Mass Spectrometry
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Particle Size Analysis
- Static Testing
- Dynamic Testing
- Hardness Testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Heat Treating
- Air Furnaces
- Controlled Atmosphere Furnaces
- High Vacuum Furnaces
- Vacuum Ovens
- ThermoElectron Twin Screw Extruder
- Shaping/Pressing
- Extruding
- Molding
- Hot pressing
- Cold pressing
- Glove Boxes
- Spray Drying
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Slurry cutting
- Spark cutting
- Abrasive saws
- Diamond saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Plasma Cleaning
- Ultrasonic Cleaning
- Abrasive Cleaning
- Machining
- Mills
- Lathes
- Drill Presses
- Band Saws
- Spark Cutters
- Surface Grinders
- Wire Pulling
- Welding/ brazing/ bonding
- Spot welding
- Inert Gas welding
- Vaccum Brazing
- Soldering
- Wire Bonding
- General Test and Measurement Equipment
- Leak detectors
- Portable Helium
- Optical Pyrometers
- Balances
- Leak detectors
- Computing and Printing
Search Equipment
Other Facilities
Facilities Contact

Jurriaan Gerretsen
- Director of Shared Experimental Facilities
- t. 607.255.4274



