LEICA 440 SEM | ||
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Bard Hall SB56 |
John Hunt | |
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SEM |
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Scanning electron microscopes (SEM) scan a sample using a focused probe of electrons in a raster pattern. The interaction of the probe with the sample produces signals containing information about the sample’s surface, composition, and in some cases, crystallography. Training is available. This SEM has a secondary electron detector for surface imaging, and a backscattered electron detector for composition-based imaging. Resolution is 6 nm at 30 KeV. Special Feature: Electron Backscatter Diffraction (EBSD) Pristine or very carefully polished (i.e. using colloidal silica) surfaces with a minimum grain size of about one micron can be characterized according to each grain’s crystallographic orientation. This is accomplished using an HKL Nordlys detector and associated software for automated acquisition and orientation analysis. Eucentric Tilting Specimen Stage: Tilting is eucentric at any working distance. This facilitates observation while tilting as high as 90 degrees, and is ideal for recording stereo pairs for 3-D viewing. | ||
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The electron gun uses a W filament. The vacuum system uses a turbopump backed by a standard mechanical pump. Images are recorded digitally. | ||
Facilities Sections
User Instruments
- Electron and Optical Microscopy
- Transmission Electron Microscopy
- Scanning Electron Microscopy
- Scanning Probe Microscopy
- Focused Ion Beam
- Optical Microscopy
- Sample Preparation for Electron Microscopy
- Spectroscopy and Electronic Measurements
- Optical Spectroscopy
- Electron Spectroscopy
- Mass Spectroscopy
- Dielectric Spectroscopy
- CNS Electronics Measurements
- Chemistry NMR Spectroscopy
- Surface Analysis and Characterization
- X-ray Photoelectron Spectroscopy
- Scanning Probe Microscopy
- Near field Scanning Optical Microscopy
- Confocal Raman Microscopy
- ADE Phase Shift MicroXAM Optical Interferometric Profiler
- Contact Profilometry
- Soft Matter/Polymer Analysis
- Size Exclusion Chromatography
- Thermal Analysis
- MALDI-TOF Mass Spectrometry
- X-ray and Diffraction Analysis
- Mechanical Properties Testing and Analysis
- Particle Size Analysis
- Static Testing
- Dynamic Testing
- Hardness Testing
- Thermal Analysis
- Size Classification
- Thin Film Deposition and Material Processing
- Thin films and coatings
- Heat Treating
- Air Furnaces
- Controlled Atmosphere Furnaces
- High Vacuum Furnaces
- Vacuum Ovens
- ThermoElectron Twin Screw Extruder
- Shaping/Pressing
- Extruding
- Molding
- Hot pressing
- Cold pressing
- Glove Boxes
- Spray Drying
- Sample Preparation, Cutting, Polishing, Shaping, Joining, and Machining
- Sub-micron-scale Cutting
- Macroscopic Cutting and Drilling
- Jet machining
- Wafer saws
- Wire saws
- Slurry cutting
- Spark cutting
- Abrasive saws
- Diamond saws
- Polishing/Grinding
- Mixing/Milling
- Sample Mounting
- Sample Cleaning
- Plasma Cleaning
- Ultrasonic Cleaning
- Abrasive Cleaning
- Machining
- Mills
- Lathes
- Drill Presses
- Band Saws
- Spark Cutters
- Surface Grinders
- Wire Pulling
- Welding/ brazing/ bonding
- Spot welding
- Inert Gas welding
- Vaccum Brazing
- Soldering
- Wire Bonding
- General Test and Measurement Equipment
- Leak detectors
- Portable Helium
- Optical Pyrometers
- Balances
- Leak detectors
- Computing and Printing
Search Equipment
Other Facilities
Facilities Contact

Jurriaan Gerretsen
- Director of Shared Experimental Facilities
- t. 607.255.4274



