HomeFacilitiesInstrumentsUser InstrumentsSample Preparation, Cutting, Polishing, Shaping, Joining, and MachiningMicroMech Wafering Machine

MicroMech Wafering Machine

20081021142817_wafer_ok.jpg-thumbBard Hall B55

Precision wafering/dicing machine with 3″, 4″, and 6″ diamond wafering blades. Table has a power feed with a 5″x 10″ magnetic chuck. Cutting is done under a water coolant mixture.

For rates information, please see the rates page.
Primary Contact

Mark Pfeifer
(607) 255-4161
Bard Hall, Room B-57
Powered By: AcademicsWeb