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Thermo Scientific Helios G4-UX FIB

Primary staff: Mick Thomas; secondary: Phil Carubia
Location: Duffield Hall 150

  • High resolution secondary and backscattered imaging even at low voltages
  • High resolution ion beam imaging, down to 2keV
  • Low-voltage milling capability produces high quality TEM lamella
  • Energy-dispersive X-ray (EDX) detector for elemental analysis and X-ray mapping
  • Deposition sources (platinum and carbon)
  • High-stability EasyLift EX Nano Manipulator for TEM sample prep, sample modification, and localized grounding for work on insulating materials
  • Auto TEM software to reduce the time needed to make TEM Lamella

To acknowledge: This work made use of a Helios FIB supported by NSF (DMR-1539918) and the Cornell Center for Materials Research Shared Facilities.