Thermo Scientific Helios G4-UX FIB
Primary staff: Mick Thomas; secondary: Phil Carubia
Location: Duffield Hall 150
- High resolution secondary and backscattered imaging even at low voltages
- High resolution ion beam imaging, down to 2keV
- Low-voltage milling capability produces high quality TEM lamella
- Energy-dispersive X-ray (EDX) detector for elemental analysis and X-ray mapping
- Deposition sources (platinum and carbon)
- High-stability EasyLift EX Nano Manipulator for TEM sample prep, sample modification, and localized grounding for work on insulating materials
- Auto TEM software to reduce the time needed to make TEM Lamella
To acknowledge: This work made use of a Helios FIB supported by NSF (DMR-1539918) and the Cornell Center for Materials Research Shared Facilities.